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Shenzhen SMTfly Electronic Equipment Manufactory Ltd
Shenzhen SMTfly Electronic Equipment Manufactory Ltd
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29*29mm FOV Solder Paste Inspection Machine For SMT Production Line Red Glue

29*29mm FOV Solder Paste Inspection Machine For SMT Production Line Red Glue

Brand Name : SMTfly
Model Number : SMTfly-V700
Certification : CE
Place of Origin : China
MOQ : 1Set
Price : USD1/Set
Supply Ability : 20Sets/Month
Delivery Time : 7-15 working days
Packaging Details : plywood case
Travel speed : 700mm/s
Air source : 4-6bar
Drive Equipment : AC Servo Motor System
Operating System : Windows 7
Interface display : 2D/3D color map
SPC Report : Anytime Report
Weight : 75Kg
Color : White
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29*29mm FOV SPI - 3D Solder Paste Inspection | Machines for SMT Line,SMTfly-V700​ Features:


Red glue detection


This device, in addition to supporting common 3D solder paste inspection, can also detect red rubber process at the same time, supporting missed printing, overflowing plastics, multiple adhesives, and low adhesives, etc., and displaying full-color defective image. Positioning.


Bare-board learning programming


No Gerber and CAD files are required, as long as a bare board is provided, automatic learning programming can be realized. The software automatically extracts the detection frame data, and the user edits it appropriately, and sets detection parameters and allowable values.


Automatic plate bend compensation


The three-dimensional plate bending compensation technique is used to perform surface fitting on the discrete reference points in the FOV to perform real-time compensation during the detection process. There is no need to move the Z axis and the detection speed is faster.


SPI - 3D Solder Paste Inspection | Machines for SMT Line,SMTfly-V700 Specification:


CategoryItemSpecifications

Inspection System

CameraFull digital high speed CCD camera, 5 million pixels
Light sourceRing LED light source
FOV29mm*29mm(18μm)
Processing time per picture<0.6s
Test contentPaste printing / red plastic printing: volume, area, height, shape, offset, continuous tin, overflow glue
Defect TypesYes, Offset, Multi-Tin, Less Tin, Continuous Tin, Tip, Collapse, Alien, Gold finger, Insufficient Height, Height Exceeded, Overfill, Insufficient, etc.
Paste height range30~400um
Paste size range0.15mm×0.15mm~10mm×10mm
Height detection accuracy1μm (based on actual solder paste and 3D correction block)
Repeat ability (volume/area/height)<1μm@3sigma
Repeat ability & Reproduce ability<10%

Software System

Operating SystemWindows 7

Identification System

Features3D bidirectional raster projection head (single head optional), no shadow 3D detection
Operational interfaceGraphical programming, easy operation, switchable English, traditional and simplified systems
Interface display2D/3D color map
MARKcan select 2 common Mark points, multi-Mark function can be selected in the puzzle, and Bad Mark function is supported
ProgrammingSupport Gerber, CAD import, support offline programming and manual programming
SPCOffline SPCSupport
SPC ReportAnytime Report
Histogram/control chartVolume,area, height, offset
Exportable Content

Reports (Excel), Pictures (jpg, bmp)


Mechanical SystemPCB Transfer SystemSubstrate fixing method: bottom-up fixing; automatic access plate and automatic width adjustment system, conforming to SMEMA standard; track height: 900±20mm
PCB size25mm*60mm~250mm*300mm (Customized)
PCB thickness0.3mm~3mm
Plate bending compensation<1mm
X, Y PlatformDrive Equipment

AC Servo Motor System

Positioning accuracy<1μm
Travel speed700mm/s
Control SystemComputer HostIndustrial Control Computer: Intel High-end quad-core CPU, 8GDDR memory, 1T hard disk
Display output19-inch widescreen LCD monitor
Other parametersMechanical dimensions (length * width * height)82cm*65cm*76cm
Weight75 kg
PowerAC220V±10%, 50/60Hz, 450W
Air source4-6bar
Working environment Temperature10-40°C, Humidity 30-80%RH


Product Tags:

smt stencil printer

      

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29*29mm FOV Solder Paste Inspection Machine For SMT Production Line Red Glue Images

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